Mechanical Engineering Intern - Thermal Simulation

During this internship, you will support Mobility Electronics product development efforts. You will work directly along side our engineers in our latest development projects, and participate directly in thermal design and analysis. The work you do will be a direct input into our products and provide you with exposure to real world engineering development processes.

Some of the activities you will be performing are:

• Design studies using CAD
• DfX (Design for Assembly, Design for Manufacturing and Design for Reliability) studies support
• Design analysis using CAE (Ansys, Abaqus, etc.)
• Data analysis with computational tools (i.e. Python, Matlab, Julia, etc.)
• Basic knowledge of Machine Learning and AI for Data Analysis
• Support Problem Solving of engineering and product problems
• Support physical and dimensional analysis of samples pre- and post-testing
• Support cross-domain engineering activities related to electronics design and development

Required Qualifications:

• Student must be pursuing M.S./M.Eng. Mechanical Engineering or equivalent
• Minimum GPA of 3.0
• Role will be in Plymouth, MI 
• Knowledge of CAD Software.
• Knowledge of Thermal and Mechanical CAE Software (e.g. FEA and CFD)
• Proficient in Data Science/Data Analysis using Python and/or other Data Science languages is required. 
• Basic Knowledge of Electronics
• Strong technical communication skills

Preferred Qualifications:

• Proactive and self-driven
• Able to work alone and in a team setting
• Strong problem-solving skills

All your information will be kept confidential according to EEO guidelines.

By choice, we are committed to a diverse workforce - EOE/Protected Veteran/Disabled.

BOSCH is a proud supporter of STEM (Science, Technology, Engineering & Mathematics) Initiatives

· FIRST Robotics (For Inspiration and Recognition of Science and Technology)

· AWIM (A World In Motion)

Indefinite U.S. work authorized individuals only.  Future sponsorship for work authorization unavailable.