Staff Engineer, Packaging Engineering (Thermal Design)

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
• The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
• The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

REQUIRED:

• B.S. in Mechanical Engineering plus 5 years, of relevant industry experience
• Solid knowledge through academic coursework or experience required in Mechanical design
• Proficiency in CAD software (e.g. SolidWorks, Autocad)
• Knowledge of engineering drafting standards and tolerance analysis 
• A strong background in mechanical design with electronic consumer product design a plus
• Knowledge of plastic injection molding and metal fabrication
• Demonstrated strong work ethic
• Prior history working with outside suppliers and contract manufacturers
• Ability to work in a team environment and interact with others to release products on schedule
• Prior retail packaging design a plus

SKILLS:

• Strong oral and written communication skills.
• Demonstrated strong work ethic.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

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