Senior Principal Embedded Engineer

Responsibilities

• Lead the architecture, design, and delivery of advanced embedded systems, including high-speed mixed-signal PCB design and embedded firmware.
• Own end-to-end product lifecycle execution, including requirements definition, feasibility analysis, system architecture, prototyping, validation, production release, and post-production sustainment.
• Design and develop multi-layer PCBs incorporating high-speed digital, analog, RF, and power electronics subsystems.
• Develop embedded firmware and platform software using C/C++, RTOS, and/or embedded Linux.
• Drive hardware/firmware/software integration, ensuring performance, reliability, and scalability in complex systems.
• Lead system-level technical decision making, including component selection, platform selection, trade studies, and risk mitigation.
• Guide design verification and validation, including unit testing, integration testing, compliance testing, and certification readiness (e.g., FCC, CE, UL).
• Serve as a technical leader and mentor, providing guidance, coaching, and technical oversight to multidisciplinary teams.
• Collaborate with cross-functional teams (mechanical, systems, software, manufacturing, controls) and external stakeholders to deliver integrated solutions.
• Support stakeholder engagement, including technical presentations, solution definition, and expectation management.
• Drive improvements in engineering processes, tools, and development methodologies to enhance execution quality and consistency.
• Oversee productization activities, including DFM/DFT, supplier engagement, production ramp, and field support.

Qualifications

• Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related STEM field.
• Experience: Typically 12+ years of experience in embedded systems engineering with demonstrated technical leadership.
• Deep expertise in:
• PCB design (high-speed digital, mixed-signal, RF, and power electronics)
• Signal integrity, EMI/EMC, and robust hardware design practices
• Strong embedded firmware experience in C/C++, with exposure to RTOS (FreeRTOS, Zephyr, RTX) and/or embedded Linux.
• Extensive experience with microcontrollers and embedded platforms (ARM Cortex, STM32, NXP, TI, Silicon Labs, etc.).
• Strong working knowledge of communication protocols, including SPI, I2C, UART, CAN, Ethernet, USB, and wireless interfaces.
• Experience with version control systems (Git) and modern collaborative development workflows.
• Proven experience implementing unit testing, automated testing, and CI/CD workflows.
• Demonstrated success delivering complex products from concept through production and field support.
• Strong expertise in debugging and root-cause analysis using lab instrumentation (oscilloscopes, logic analyzers, spectrum analyzers).
• Excellent communication skills with experience working in customer-facing or cross-functional environments.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee of granted asylum

Desired

• Experience with high-speed interfaces (DDR, PCIe, SerDes, high-speed ADC/DACs).
• Familiarity with FPGA design and integration (Xilinx/AMD, Microchip).
• Experience with RF systems, wireless communication, and antenna integration.
• Knowledge of power electronics and motor control systems.
• Experience with compliance and certification processes (FCC, CE, UL, CSA, PTCRB).
• Proficiency in supporting tools and languages such as Python or C# for test automation and tooling.
• Experience leading distributed or offshore engineering teams.
• Background in multi-disciplinary system design (hardware, firmware, software, and mechanical integration).
• Exposure to AI/ML-enabled engineering workflows or advanced automation tools.