Wirebond Operator

Overview

OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. With more than 30 years of combined experience in the field of optoelectronics our OSI Optoelectronics (OSIO) division is a diversified manufacturer of standard and custom photodiodes and optical sensors for used in aerospace, defense, commercial and medical applications.

We are one of the largest global manufacturers of optoelectronic devices, delivering engineering design support and manufacturing capabilities that include products for use in the defense, aerospace, medical, and industrial markets, among others. We utilize our world-class manufacturing facilities in the U.S., India and Malaysia to continue to put forth excellent engineering solutions aligned with efficient manufacturing to meet high-volume production requirements.

OSI Optoelectronics is seeking a Wirebond Operator. This individual will be responsible for the set-up, operation, and inspection of ultrasonic and thermosonic wire bonding processes used in the assembly of optoelectronic devices and microelectronic components. They will perform precision work under high magnification, follows blueprints and assembly drawings, and supports product quality, traceability, and production schedules in a controlled manufacturing environment.

Responsibilities

• Perform wire bond set-ups and operate wire bonding equipment to produce reliable interconnections for optoelectronic devices, microelectronic assemblies, and related components. Verify tooling, bonding wire, bonding programs, workholder alignment, and part identity, orientation, and alignment prior to production release to ensure compliance with drawings, specifications, and assembly requirements.
• Set up wire bonding equipment, tools, and materials in accordance with approved work instructions, process parameters, and production requirements.
• Inspect wire bonds under 10x to 20x magnification to verify bond quality, placement, and workmanship and to identify defects such as non-sticks, wire sweep, improper loop height, bond lifts, misalignment, and surface damage. Clean parts, tools, and work surfaces as needed using approved methods and materials to maintain product cleanliness and process integrity, and report nonconforming conditions promptly.
• Clean parts, tools, and work surfaces as required using approved methods and materials to maintain product cleanliness and process integrity.
• Uphold the company’s core values of Integrity, Innovation, Accountability, and Teamwork.
• Demonstrate behavior consistent with the company’s Code of Ethics and Conduct.
• It is the responsibility of every employee to report to their manager or a member of senior management any quality problems or defects in order for corrective action to be implemented and to avoid recurrence of the problem.
• Duties may be modified or assigned at any time to meet the needs of the business.

Qualifications

• High School Diploma or equivalent required . Relevant experience may be substituted for a degree.
• 1+ years’ experience in wire bonding, microelectronics assembly, or optoelectronics manufacturing required.
• Must have ability to read and interpret blueprints, assembly drawings, and manufacturing instructions.
• Must have excellent hand-eye coordination, manual dexterity, and attention to detail.
• Must be able to work with, and properly handle, lab chemicals such as acetone, methanol, and propanol as per Company procedures.
• Ability to maintain accurate records and follow verbal and written instructions are essential.
• Must be a team player.
• Must be able to read, write, and communicate effectively in the business language (English).

Please review our benefits here: Life at OSI

Pay may range from $19.00 to $20.00 hourly The pay range above represents annual base salary only. Final compensation will be determined based on factors such as your job level, geographic location, date of hire, experience, job-related knowledge and skills, and education in conjunction with market and business considerations. Base salary is one component of your total rewards package. You may be eligible for long-term incentives, potential discretionary bonuses, and the ability to purchase company stock at a discounted rate through the Employee Stock Purchase Program (ESPP). OSI also offers comprehensive benefits including various options for health plans, access to 401(k) retirement plan, health savings account, disability insurance, life insurance, AD&D insurance, leave of absence programs and an array of voluntary benefits. In addition, paid time off is offered to be used for vacation, holidays, bereavement, and jury duty. Full-Time salaried employees are entitled to flexible time-off.

NOTICE TO THIRD PARTY AGENCIES

OSI Systems, Inc. and its subsidiaries (collectively “OSI”) does not accept unsolicited resumes from recruiters or employment agencies. If any person or entity, including a recruiter or agency, submits any information, including any resume or information regarding any potential candidate, without a signed agreement in place with OSI, OSI explicitly reserves the right to use such information, and pursue and/or hire such candidates, without any financial obligation to the person, recruiter or agency. Any unsolicited information or resumes, including those submitted directly to hiring managers, are considered and deemed to be the property of OSI.

Equal Opportunity Employer - Disability and Veterans

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Poster Link

https://www.eeoc.gov/sites/default/files/2023-06/22-088_EEOC_KnowYourRights6.12ScreenRdr.pdf

OSI Systems, Inc. has three operating divisions: (a) Security, providing security and inspection systems, turnkey security screening solutions and related services; (b) Healthcare, providing patient monitoring, diagnostic cardiology and anesthesia systems; and (c) Optoelectronics and Manufacturing, providing specialized electronic components and electronic manufacturing services for original equipment manufacturers with applications in the defense, aerospace, medical and industrial markets, among others.