Engineer, packaging engineering

•Defines, develops and qualifies new wire bonded as well as flip chip semiconductor packages with subcontractors and maintains quality of existing packages. ·    

•Manages next generation packaging technologies with internal R&D teams and eternal technology partners  

•Works closely with the various business units within the company to understand future product needs and suggest packaging solutions.

•Drive yield improvement and better efficiency of subcontractors operation  

•Manages the entire life cycle of packages from path finding all the way to qualification and HVM

•Master degree in Electrical Engineering, Chemical Engineering, 

  Material Science, Physics, or a related engineering discipline

•Excellent communication and interpersonal skills is required

•Strong problem-solving and analytical skills would be highly

  desirable

•Knowledge of IC fabrication and packaging is plus.

•This is an entry-level position; no prior work experience is needed.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.